SEMI · Power Semiconductor
Weber-I3000
IGBT special 3D inspection system
Completely present the aluminum wire morphology and accurately identify packaging defects
For IGBT power modules and Wire Bond process, comprehensive quality inspection of aluminum wires, chips, solder joints and ceramic substrates is realized
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Product Positioning
Aiming at the detection needs and pain points of IGBT power modules, the equipment obtains complete three-dimensional information of aluminum wires and packaging structures through panoramic deep 3D imaging, and uses AI algorithms to detect complex appearance abnormalities.
Core Advantages
Panoramic deep 3D imaging
Obtain the complete three-dimensional morphology of aluminum wire and packaging structures
Comprehensive inspection of aluminum wires and solder joints
Identify line, connection and bonding area anomalies
AI complex defect identification
Detect complex defects on chips, substrates and packaging materials
Detect multiple objects at once
Covers aluminum wire, chips, solder joints, components and substrates
Inspection Capabilities
3D detection effect
2D detection effect
Key Specifications
Inspection Type
2D appearance inspection, panoramic depth 3D imaging, and AI-Powered Defect Recognition of IGBT products
Detectable Defects
Broken wires, missing wires, disconnected points, solder overflow, chip chip edges, missing corners, scratches, contamination, glue, dents, foreign objects and missing components, etc.