PRODUCT CENTER
Provide high-precision 2D/3D inspection and metrology system for electronic manufacturing and semiconductor processes
Spectra series
Wafer-level 2D+3D inspection and metrology system
Weber series
Packaging inspection system
Hubble series
Optical module inspection system
3D+AI, detect multiple types of defects at one time
Synchronous detection of front and back sides, simplifying manufacturing process and equipment investment
Discover defects from the printing source and stabilize welding quality
Use AI to replace repeated visual inspections to maintain shipment quality
Micron-level measurement, insight into SIP packaging details
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