SEMI · Optical Communications
Hubble-3000
Optical module 3D inspection equipment
Completely presents the microstructure and protects the packaging quality of optical modules
For precision packaging of optical communication modules, comprehensive quality inspection of bonding wires, solder balls, chips and packaging areas is achieved
Get product brochure
Please complete the form. Our marketing team will contact you to discuss your requirements.
Product Positioning
Hubble-3000 is oriented to optical communication modules and related precision packaging processes
Suitable for 400G/800G/1.6T optical module testing equipment to obtain complete three-dimensional information of gold wires, solder balls, chips and packaging structures, and identify line arcs, connection status, solder ball morphology and chip appearance abnormalities
Core Advantages
Panoramic deep 3D imaging
Presenting precision packaging structures at different heights
Bonding wire complete inspection
Obtain spatial direction, arc height and connection status
Solder ball 3D measurement
Analyze solder ball height, thickness and overall morphology
AI complex defect identification
Identify abnormalities in chips, components and packaging areas
3D detection capability
Gold wire shape detection (whether there are few wires, multiple wires, whether there is collapse and side tilt, whether the gold wire is connected to the chip, gold wire breakage, gold wire height & arc, etc.)
Golden ball detection (golden ball thickness, gold ball height, few balls, abnormal balls, abnormal line tail)
Key Specifications
Inspection Type
2D appearance inspection, panoramic depth 3D imaging, AI defect recognition
Detectable Defects
Missing lines, multiple lines, broken lines, wrong lines, overlapping, collapsed lines, side tilt, abnormal arc height, missing balls, abnormal balls, tailing and chip appearance defects, etc.