SEMI · Wire Bond
Weber-G3000
Special 3D inspection equipment for micro assembly
Completely reconstruct bonding lines and accurately detect micro-assembly defects
For Wire Bond and micro-assembly processes, realize automatic detection of copper wires, silver wires, gold wires and chip packaging structures
Get product brochure
Please complete the form. Our marketing team will contact you to discuss your requirements.
Product Positioning
Weber-G3000 is targeted at semiconductor Wire Bond and micro-assembly processes. The equipment obtains the complete spatial topography of the bonding wire through panoramic deep 3D imaging, and combines it with AI algorithms to identify complex appearance defects in the packaging area.
Core Advantages
Complete 3D imaging of bond wires
Present arc height, routing and connection status
Various wire detection
Covering processes such as copper wire, silver wire and gold wire
Fine gold wire detection capability
Supports complete 3D imaging of gold lines as thin as 17 μm
AI-assisted defect identification
Identify abnormalities such as complex appearance, misaligned and missing lines
3D imaging effect
AI can detect defects
Key Specifications
Inspection Type
2D appearance inspection, panoramic depth 3D imaging, AI defect recognition
Detectable Defects
Abnormal arc height, bonding wire bending, broken wires, missing wires, wrong wires, abnormal connections and chip appearance defects, etc.