SMT·Final appearance inspection
Sigma 3D SPI
Discover defects from the printing source and stabilize welding quality
For the solder paste printing process, timely identification of abnormalities in solder paste volume, area, height and position through high-precision 3D measurement
Get product brochure
Please complete the form. Our marketing team will contact you to discuss your requirements.
Product Positioning
Sigma is a 3D SPI equipment for SMT solder paste printing quality control
The equipment identifies excess, insufficient, missing prints, bridging, copper exposure and offset through high-precision three-dimensional measurement, providing reliable process guarantee for subsequent chip placement and reflow soldering.
Core Advantages
High-precision 3D measurement
Obtain solder paste height, area, volume and morphology information
Dual projection reduces shadows
Reduce the impact of occlusion on 3D reconstruction and detection results
High-speed and stable detection
Taking into account detection accuracy and production line rhythm
Process data feedback
Provide quantitative basis for printing process adjustment
Applications
3C consumption
Automotive electronics
information communication
medical equipment
Detection capability
Key Specifications
Detection resolution
5/10/15 μm
Check speed
0.4 FOV/s
Inspection Type
3D solder paste inspection
Detectable Defects
Too much solder paste, insufficient solder paste, missing printing, bridging, exposed copper, offset