SMT · Solder Paste Inspection
Alpha
SIP system-level packaging testing equipment
Micron-level measurement, insight into SIP packaging details
Integrating appearance defect detection, 3D imaging and dimensional measurement capabilities to achieve refined quality control of mirror chips and packaged devices
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Product Positioning
Alpha is a dedicated 3D optical inspection equipment for semiconductor SIP system-in-package
The equipment can perform appearance inspection, three-dimensional morphology analysis and AOM size measurement on mirror chips and packaged devices.
Applications
Applications
Key Specifications
Detection resolution
3.1/5.7 μm
Detection speed
0.8 s/FOV
Inspection Type
2D appearance, 3D topography, AOM size measurement
Detectable Defects
Foreign objects, chipped edges, missing corners, scratches, dents, abnormal size and shape